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Newsletter July 2025 | Menu of Newsletters





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Applications Microscopy Micro-Hardness Testing Optical & Laser Systems Spacecraft Testing Biology & Neuroscience Microelectronics & MEMS Analytical Balances Audio/Turntables Vacuum Isolation What's the Right System Large-Displacement Heavy Systems Our Technology FAQs Case Studies Performance Testimonials Glossary BM-10 Platform-Bench Top BM-8 Platform-Bench Top BM-6 Platform-Bench Top BM-4 Platform-Bench Top BM-1 Platform-Bench Top BA-1 Platform-Bench Top MK26 Table-Workstation MK52 Optical Table WS4 Table-Workstation CM-1 Compact CT-10 Ultra-Thin CT-10 Ultra-Thin LC-4 Ultra Compact SM-1 Large Capacity FP-1 Floor Platform Custom Systems Manuals & Documents Customers Videos Newsletters


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Minus K Educational Giveaway Winner:


Micron-Level Wafer Characterization Research at
Northwestern Universitys Hersam Research Group


The lab has pushed the limits of semiconductor wafer characterization in microscale electronic devices. Facilitating this research is Negative-Stiffness vibration isolation.



The Hersam Research Group – part of the Department of Materials Science & Engineering, McCormick School of Engineering & Applied Science, at Northwestern University studies, develops and manipulates hybrid hard and soft nanoscale materials for applications in information technology, biotechnology, nanotechnology and alternative energy. The labs advanced electronic and chemical characterization techniques provide deep insight into these areas, with key examples including impedance spectroscopy for photovoltaics and scanning conductive ion microscopy for lithium ion batteries. Such techniques offer a better understanding of the key issues in enabling practical applications of these technologies.

Micron-Level, Wafer Characterization
Another of the groups areas of interest is semiconductor micron-level, wafer characterization. Wafers, being a thin slice of semiconductor, such as crystalline silicon, are used for the fabrication of integrated circuits, and in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in, and upon the wafer.

During semiconductor device manufacturing, wafer testing is performed, where all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test patterns. The wafer testing is performed by a piece of test equipment called a wafer prober. For electrical testing, a set of microscopic contacts or probes, called a probe card, are held in place while the wafer, vacuum-mounted on a wafer chuck, is moved into electrical contact.

The Hersam Research Group has developed a digital wafer map, allowing thousands of devices to be probed in an automated fashion.

On some of these devices we have 1,000 transistors to characterize inside of a small sample, said William A. Gaviria Rojas, with the Hersam Research Group. We are using an automated probe station, manufactured by Cascade Microtech, for semiconductor micron-level, wafer scale characterization on the devices we fabricate.

Before, the experiments were performed with a manual probe station, taking 1 3 hours to complete. Then, the lab switched to the automated probe station which enabled it to collect data for 2 3 days.

The manual process did not display small misalignments in the movement of the probes over the 1 3 hour characterization, continued Rojas. But the longer 2 3 day characterization experiments showed considerable interruptions during high traffic times the small probes that were in contact with the devices were losing contact.

We were looking for a vibration isolation solution that would require low maintenance, with no additional things like compressed air or electricity, explained Rojas. For these reasons we selected the Minus K, Negative-Stiffness WS-4 compact vibration isolation table.

Vibration Isolation
The Group determined that the problem was vibration caused by people walking by, opening and closing doors in, and near, the lab where the probe station was located. There was also vacuum and pump equipment located in the room which created vibration.

The probe station was positioned on top of cinder blocks, with plastic material between. This was the extent of vibration isolation being employed, which was inadequate.

A typical laboratory will almost always position sensitive micron-level instrumentation on a vibration isolation platform. Isolating such imaging equipment against low-frequency vibration has become increasingly more vital to maintaining imaging quality and data integrity. Indeed, the labs other Raman and AFM instrumentation all have a more sophisticated level of vibration isolation in place.

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The MK52


NASA Telescope Project

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Spacecraft Vibration Isolation On the Ground

Minus K Technology Inc., Vibration Isolation Systems
460 Hindry Ave., Unit C | Inglewood, CA 90301 | Tel: 310-348-9656 | Contact Us | www.MinusK.com